Cooling: For cooling temperature under BOD Incubator
Wavelength are scanned from high to low so that the instrument waits at high Wavelength and minimizes the degradation of UV sensitive samples
affecting the diode's performance
0°C Humidity Uniformity ±3
NO.903UL 0.08mm Thickness NITTO DENKO Teflon High Temperature Tape for Sealing Machine , Size: 10m x 38mm, Size: 10m x 38mm Option:Size: 10m x 38mm Cooling: For cooling temperature under1. Material: fluorine resin. 2. Temperature: long term temperature resistance 50 250 degrees centigrade, short term temperature resistance 50 300 degrees centigrade. 3. Good electrical properties, heat resistance, chemical resistance, low friction coefficient, non adhesion and other symptoms. 4. Application industry: LCD and other electronic industry, packaging industry, sealing machine, electrical products, battery manufacturing and so on.